september 2010 doc id 13251 rev 3 1/8 8 emif03-sim02c2 3-line ipad? emi filter including esd protection features emi symmetrical (i/o) low-pass filter high efficiency in emi filtering lead-free coated package very low pcb space occupation: ? 1.42 mm x 1.42 mm very thin package: 0.65 mm high efficiency in esd suppression high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging complies with following standards: iec 61000-4-2 level 4 on external and v cc pins: ? 15 kv (air discharge) ? 8 kv (contact discharge) mil std 883g - method 3015-7 class 3 applications where emi filtering in esd sensitive equipment is required: sim interface (subscriber identify module) uim interface (universal identify module) description the emif03-sim02c2 is a highly integrated device designed to suppress emi/rfi noise in all systems subjected to electromagnetic interference. the emif03 flip-chip packaging means the package size is equal to the die size. this filter includes an esd protection circuitry which protects the application from damage when subjected to esd surges up 15 kv. tm: ipad is a trademark of stmicroelectronics figure 1. pin configuration (bump side) coated flip-chip package (8 bumps) b c 1 2 3 a rst in rst ext clk in data in gnd v cc clk ext data ext www.st.com
characteristics emif03-sim02c2 2/8 doc id 13251 rev 3 1 characteristics figure 2. basic cell configuration figure 3. electrical characteristics (definitions) table 1. absolute ratings (limiting values) symbol parameter value unit v pp internal pins (a3, b3, c3): esd discharge iec61000-4-2, air discharge esd discharge iec61000-4-2, contact discharge external pins (a2, b1, c2, c1): esd discharge iec61000-4-2, air discharge esd discharge iec61000-4-2, contact discharge 2 2 15 8 kv t j maximum junction temperature 125 c t op operating temperature range -40 to +85 c t stg storage temperature range -55 to +150 c 47 clk in data in clk ext data ext 100 r1 r2 r3 rst in rst ext 100 v cc gnd cline = 20pf max. i v i f i rm i r i pp v rm v f v br v cl symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = forward current i = peak pulse current i = breakdown current v = forward voltage drop br rm rm rm pp r f f v = clamping voltage cl
emif03-sim02c2 characteristics doc id 13251 rev 3 3/8 table 2. electrical characteristics, parameter values symbol test conditions min typ max unit v br i r = 1 ma 6 20 v i rm v rm = 3 v 0.2 a r d 1.5 r 1 , r 3 tolerance 20% 100 r 2 tolerance 20% 47 c line v r = 0 v 20 pf figure 4. s21 (db) attenuation measurement (a2-a3 line) figure 5. s21 (db) attenuation measurement (b1-b3 line) 100.0k 1.0m 10.0m 100.0m 1.0g -40.00 -30.00 -20.00 -10.00 0.00 emif03-sim02c2_freq-meas_pm428 aplac 7.70 user: st microelectronics sep 22 2004 db f/hz a2/a3 line 100.0k 1.0m 10.0m 100.0m 1.0g -40.00 -30.00 -20.00 -10.00 0.00 emif03-sim02c2_freq-meas_pm428 aplac 7.70 user: st microelectronics sep 22 2004 db f/hz b1/b3 line figure 6. s21 (db) attenuation measurement (c1-c3 line) figure 7. analog crosstalk measurements 100.0k 1.0m 10.0m 100.0m 1.0g -40.00 -30.00 -20.00 -10.00 0.00 emif03-sim02c2_freq-meas_pm428 aplac 7.70 user: st microelectronics sep 22 2004 db f/hz c1/c3 line 100.0k 1.0m 10.0m 100.0m 1.0g -100.00 -90.00 -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 emif03-sim02c2_freq-meas_pm428 aplac 7.70 user: st microelectronics sep 22 2004 db f/hz xtalk a2/b3
characteristics emif03-sim02c2 4/8 doc id 13251 rev 3 figure 10. line capacitance versus reverse applied voltage (typical) figure 11. aplac model figure 8. voltages when iec 61000-4-2 (+15 kv air discharge) applied to external pin figure 9. voltages when iec 61000-4-2 (-15 kv air discharge) applied to external pin 100ns/d vexternal : 10v/d vinternal : 10v/d 100ns/d vexternal : 5v/d vinternal : 5v/d 0. 00 4. 00 8. 00 12. 00 16. 00 20. 00 012345 vr(v) c(pf) 50 port1 ls 100m a2 port2 50 100m ls a3 100 47 100 0.29 0.31 dint1 dint2 0.29 dint1 0.25 dext1 0.28 dext2 0.25 dext1 bulk lbump rbump lbump rbump lbump rbump lbumprbump lbump rbump lbumprbump bulk rsub cbump bulk rsub cbump a3 bulk rsub cbump b1 c3 bulk rsub cbump bulk rsub cbump bulk rsub cbump a2 b3 c1 lbump rbump lgnd rgnd cgnd
emif03-sim02c2 ordering information scheme doc id 13251 rev 3 5/8 figure 12. aplac parameters 2 ordering information scheme figure 13. ordering information scheme ls 950ph rs 150m cext1 15pf cint1 4.5pf cext2 14pf cint2 4pf rbump 20m lbump 50ph cbump 0.15pf rgnd 500m lgnd 50ph cgnd 0.15pf rsub 100m model dint1 bv=15 cjo=cint1 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.001m vj=0.6 tt=50n model dext1 bv=15 cjo=cext1 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.001m vj=0.6 tt=50n model dint2 bv=15 cjo=cint2 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.001m vj=0.6 tt=50n model dext2 bv=15 cjo=cext2 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.001m vj=0.6 tt=50n emif yy - xxx zz cx emi filter number of lines information package 3 letters = application 2 digits = version c = coated flip chip x = 2: lead-free, pitch = 500 m, bump = 315 m
package information emif03-sim02c2 6/8 doc id 13251 rev 3 3 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 14. flip-chip dimensions figure 15. marking figure 16. footprint recommendation 1.42mm 50m 1.42mm 50m 315m 50 500m 50 500m 50 695m 65 x y x w z w dot, st logo ecopack status xx = marking yww = datecode (y = year z = manufacturing location copper pad diameter: 250 m recommended, 300 m max solder stencil opening: 330 m solder mask opening recommendation: 340 m min for 315 m copper pad diameter
emif03-sim02c2 ordering information doc id 13251 rev 3 7/8 figure 17. flip-chip tape and reel specification 4 ordering information 5 revision history dot identifying pin a1 location user direction of unreeling all dimensions in mm 4 +/- 0.1 8 +/- 0.3 4 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 ? 1.5 +/- 0.1 0.78 +/- 0.05 xxz yww st e xxz yww st e xxz yww st e table 3. ordering information ordering code marking package weight base qty delivery mode emif03-sim02c2 gr flip chip 3.04 mg 5000 7? tape and reel table 4. document revision history date revision changes 07-feb-2007 1 initial release. 21-mar-2007 2 updated weight in ordering information. 02-sep-2010 3 updated marking in ta b l e 3 .
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